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Substrate for SAW devices, roughened backside

Ultra-precise blasting processing for wafers! Easy operation, effective as a noise countermeasure from the backside.

We would like to introduce our product, "Backside Roughening Substrate for SAW Devices." It supports wafer sizes of Φ4 and 6 inches and uses fine grinding materials of approximately #1000. The processing is fully automated by simply setting the workpiece at the front of the main unit. The roughness can be specified within the range of Ra0.1 to 1μm. This product addresses issues such as the tendency to crack and break, long processing times on grinding machines, and high running costs. 【Features】 ■ Supports wafer sizes of Φ4 and 6 inches ■ Uses fine grinding materials of approximately #1000 ■ Fully automated processing with easy operation by simply setting the workpiece at the front of the main unit ■ Roughness can be specified within the range of Ra0.1 to 1μm